To solve problem of conventional technology of adhesion by detecting local curing and flow (curing state) of an adhesive and controlling curing state of the adhesive to realize uniform cure shrinkage of the adhesive in the whole adhering region so as to reduce displacement of the subject to be adhered and residual stress caused from cure shrinkage in adhering.
The invention relates to the method for adhesion, on the assumption that the method uses the adhesive to adhere the subject to be bonded, wherein the adhesive is an energy-curing type adhesive obtained by mixing the adhesive and discriminating particles and the method comprises a process coating the adhesive on the subject to be adhered, a process detecting state of movement of the particles in curing the adhesive by irradiating energy ray and a process specifying the point to irradiate the energy ray to cure the adhesive according to the result of the detection of the movement of the particles.
TANEDA YUSUKE
OSHIMA HISAYOSHI
TERU TAROU
KANEKO YUTAKA
| JP2003270261A | 2003-09-25 | |||
| JP2002372489A | 2002-12-26 | |||
| JPH09296155A | 1997-11-18 | |||
| JPH05331438A | 1993-12-14 |