Title:
METHOD FOR ADJUSTING HEIGHT OF POLISHING HEAD AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2020192634
Kind Code:
A
Abstract:
To provide a method for adjusting a height of a polishing head by which a down time of a polishing device can be reduced, and a cost required when replacing an abrasive pad can be reduced.SOLUTION: According to this method, a reference height of a polishing head 20 holding a substrate which presses a polishing surface of a first polishing pad supported on a polishing table 12, and a reference height of a dresser 50 which presses the polishing surface of the first polishing pad are determined, an initial height of the dresser 50, which presses a polishing surface of a second polishing pad supported on the polishing table 12, is determined after the first polishing pad is replaced with the second polishing pad, and the reference height of the polishing pad 20 is corrected on the basis of the reference height of the dresser 50 and the initial height of the dresser 50.SELECTED DRAWING: Figure 3
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Inventors:
MAEDA YOSHIHIKO
OTA HIROSHI
OTA HIROSHI
Application Number:
JP2019099272A
Publication Date:
December 03, 2020
Filing Date:
May 28, 2019
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B47/22; B24B37/10; B24B49/18; B24B53/017; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Kanazawa Mitsuhiro
Isamu Watanabe
Goto Manabu
Kanazawa Mitsuhiro