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Title:
METHOD AND APPARATUS FOR APPLICATION
Document Type and Number:
Japanese Patent JP2006068673
Kind Code:
A
Abstract:

To form a uniform coating film without coating nonuniformity on a substrate by performing liquid coating stably, securely and excellently at a coating start position through a gap from a longitudinal coating nozzle side to a substrate to be treated.

Timing in which a resist nozzle 120 descends to a position having the height of the coating start position is staggered between the left end part and right end part (provide time difference). More in detail, one end part of the resist nozzle 120, for example the right end part, descends beforehand to the position having the height of the coating start position, first, a liquid film RF attached to the lower end part of the resist nozzle 120 is adhered to the substrate G by the right end part, thereafter, shortly delayed, the left end part of the resist nozzle 120 descends to the position having the height of the coating start position. Thus, the liquid film RF located on the lower end part of the resist nozzle 120 applies (adheres) a liquid on the substrate G from the right end part toward the left end part of the resist nozzle 120.


Inventors:
MOTODA KIMIO
IKEDA FUMIHIKO
TOYOYOSHI YUKIO
Application Number:
JP2004257052A
Publication Date:
March 16, 2006
Filing Date:
September 03, 2004
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B05D1/26; B05C5/02; H01L21/027
Domestic Patent References:
JPS61147234A1986-07-04
JP2001276721A2001-10-09
JPH06339665A1994-12-13
JP2002500097A2002-01-08
JP2002001195A2002-01-08
JP2004014607A2004-01-15
JPH10156255A1998-06-16
Attorney, Agent or Firm:
Filial piety Sasaki