To form a uniform coating film without coating nonuniformity on a substrate by performing liquid coating stably, securely and excellently at a coating start position through a gap from a longitudinal coating nozzle side to a substrate to be treated.
Timing in which a resist nozzle 120 descends to a position having the height of the coating start position is staggered between the left end part and right end part (provide time difference). More in detail, one end part of the resist nozzle 120, for example the right end part, descends beforehand to the position having the height of the coating start position, first, a liquid film RF attached to the lower end part of the resist nozzle 120 is adhered to the substrate G by the right end part, thereafter, shortly delayed, the left end part of the resist nozzle 120 descends to the position having the height of the coating start position. Thus, the liquid film RF located on the lower end part of the resist nozzle 120 applies (adheres) a liquid on the substrate G from the right end part toward the left end part of the resist nozzle 120.
IKEDA FUMIHIKO
TOYOYOSHI YUKIO
JPS61147234A | 1986-07-04 | |||
JP2001276721A | 2001-10-09 | |||
JPH06339665A | 1994-12-13 | |||
JP2002500097A | 2002-01-08 | |||
JP2002001195A | 2002-01-08 | |||
JP2004014607A | 2004-01-15 | |||
JPH10156255A | 1998-06-16 |
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