Title:
METHOD AND APPARATUS FOR APPLYING SOLUTION AROUND SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPH07201838
Kind Code:
A
Abstract:
PURPOSE: To provide a method and an apparatus for applying an insulating solution uniformly in a short time around the circumferential part of a semiconductor wafer without generating bubbles.
CONSTITUTION: In a step for applying an insulating solution 4 to the circumferential edge 1a of a semiconductor wafer 1, a transcribing roller 3 has a U-shaped groove 3a, which is filled with the insulating solution 4 with high viscosity, so that the circumferential edge 1a of the semiconductor wafer 1 is dipped in the insulating solution 4. After the insulating solution 4 is transcribed to the circumferential edge 1a of the semiconductor wafer 1, the insulating solution 4 is hardened by blowing hot gas 5a of inert gas through a hot gas nozzle 5.
Inventors:
ISHIKAWA KENJI
Application Number:
JP33405093A
Publication Date:
August 04, 1995
Filing Date:
December 28, 1993
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/31; H01L21/312; (IPC1-7): H01L21/312; H01L21/31
Attorney, Agent or Firm:
Iwao Yamaguchi