Title:
複数の層を熱的に接続するための方法、装置、及びアセンブリ
Document Type and Number:
Japanese Patent JP7294712
Kind Code:
B2
Abstract:
The present disclosure relates to an integrated circuit assembly that comprises a die, an upper layer and a thermal interface material. The thermal interface material is disposed in contact with the die and the upper layer. The thermal interface material comprises a polymer and liquid metal droplets dispersed throughout the polymer. A bondline distance formed between the die and the upper layer is no greater than 150 microns. The liquid metal droplets are in a liquid phase at least at a temperature in a range of -19 degrees Celsius to 30 degrees Celsius. The polymer is elastomeric.
Inventors:
Navid Casem
Carmel Majidi
Carmel Majidi
Application Number:
JP2022035986A
Publication Date:
June 20, 2023
Filing Date:
March 09, 2022
Export Citation:
Assignee:
Arieca Inc.
International Classes:
H01L23/373; H01L23/36
Domestic Patent References:
| JP4551074B2 |
Attorney, Agent or Firm:
Maruyama International Patent Office