PURPOSE: To eliminate an engagement of an IC frame with a position control member during conveying of the frame in blasting the frame and to obviate necessity of special operation when the width of the frame is altered during processing.

CONSTITUTION: A method for blasting an IC frame comprising the steps of circumferentially moving a conveying band 8 formed with an inverted triangular- shaped sectional support groove D in parallel with a supporting plate 11, injecting slurry from a nozzle unit 2 above an IC frame F merely placed on an oblique surface of the groove, then rotating the frame by an inverter 3 to be positioned on other oblique surface, and injecting the slurry by another nozzle unit to the upper surface of the frame after becoming the above state.