PURPOSE: To bond a film even a curved objective surface in uniform film thickness without generating warpage in the film.

CONSTITUTION: In a method for bonding a film to an objective surface 1 through a UV resin, a UV resin layer is formed to the objective surface 1 and the film is placed thereon and air is blown against the periphery of the film from a ring-shaped pipe 72 before the UV resin layer is cured. A film bonding apparatus has an ultraviolet irradiation lamp 70 irradiating the ultraviolet curable resin layer formed between the objective surface 1 and the film with ultraviolet rays and the ring-shaped pipe 72 blowing air against the periphery of the film before the film is irradiated with ultraviolet rays by the ultraviolet irradiation lamp 70.