METHOD AND APPARATUS FOR CLEANING PROCESS

Title:

METHOD AND APPARATUS FOR CLEANING PROCESS

Document Type and Number:

Japanese Patent JPH11243074

Kind Code:

A

Abstract:

To improve cleaning performance by stabilizing the flow rate of a cleaning liquid and making the concentration of the cleaning liquid constant.

This apparatus is provided with a processing tank which contains a semiconductor wafer W, cleaning-liquid supplying nozzles 32 which supply the cleaning liquid into a processing tank 30, a pure-water supply source 31 which is connected to the cleaning-liquid supplying nozzles 32 via a cleaning- liquid supplying pipe 33, and a chemical supplying source 35, which is connected to the cleaning-liquid supplying pipe 33 via an opening and closing valve V3. On the side of the pure-water supplying source 31 of the cleaning-liquid supplying pipe 33, a flow-rate (pressure) controller 36 is provided. At the outflow side of the flow-rate (pressure) controller 36, a flow-rate adjusting opening and closing valve V2 is provided. At the same time, a discharging pipe 41 for dummy flow is provided between the opening and closing valve V1 and the flow-rate (pressure) controller 26 via an opening and closing valve V5.

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Inventors:

SHINDO NAOKI
KITAHARA SHIGENORI
HAMAMURA NAOHIKO
KOUJIYOU KOUKICHI
MOMOTAKE HIRONOBU

Application Number:

JP11647098A

Publication Date:

September 07, 1999

Filing Date:

April 27, 1998

Export Citation:

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Assignee:

TOKYO ELECTRON LTD

International Classes:

H01L21/304; G05D11/02; (IPC1-7): H01L21/304; G05D11/02; H01L21/304

Attorney, Agent or Firm:

Kikuhiko Nakamoto

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