To provide a method and an apparatus for cleaning a substrate, by which the substrate can efficiently be cleaned surely by arranging the substrate in a gap between two opposed main planes of a cleaning vessel and shutting the cleaning vessel tightly.
This cleaning method comprises a fluid introducing route forming step to make a cleaning fluid flow in a buffer part 18 through two fluid introducing pipelines 20 branched from a fluid pipeline 26, a flow path changing step to make the opposing currents of the cleaning fluid collide/merge with each other at the part 18 and change the flow direction of the merged cleaning fluid by 90° so that the merged cleaning fluid is made to flow in an introduction part 14, an inlet flow straightening step to make the cleaning fluid flowed in the part 14 flow in the cleaning vessel 12 by expanding the current width and thinning the current thickness while the flow velocity is kept as it is, a cleaning step to make the cleaning fluid made to flow in the vessel 12 flow upward along the both faces of a wafer 22 uniformly at a high speed for dissolving or peeling off foreign matter stuck to the surfaces of the wafer 22 and an outlet flow straightening step to make the used cleaning fluid flow out of the vessel 12 to a discharge part 16 while the fluidized state is kept as it is.
GOTO HIDETO
NIBUYA TAKAYUKI
| JPH11121415A | 1999-04-30 | |||
| JPH11319737A | 1999-11-24 | |||
| JPH07321084A | 1995-12-08 | |||
| JPH0186232U | 1989-06-07 |
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