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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR CORRECTING DEFECT IN PATTERN SUBSTRATE AND MANUFACTURING METHOD OF PATTERN SUBSTRATE
Document Type and Number:
Japanese Patent JP2005317802
Kind Code:
A
Abstract:

To provide a method and an apparatus for correcting a defect in a pattern substrate capable of stably correcting the defect and a manufacturing method of a pattern substrate.

The defect correcting apparatus comprises: a film 5 provided oppositely to a substrate 6; a pulse laser light source 1 for emitting laser light to provide an opening in the film 5; a pressing unit 30 for applying a defect correcting solution on the defect portion of the substrate 6 via the opening and pressing it to the substrate 6 to squeeze the solution applied on the substrate 6 via the opening into the defect; and a squeegee 31 provided movably in the direction nearly parallel to the substrate 6 and provided above the opening for removing the solution.


Inventors:
TAJIMA ATSUSHI
KUSUSE HARUHIKO
Application Number:
JP2004134454A
Publication Date:
November 10, 2005
Filing Date:
April 28, 2004
Export Citation:
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Assignee:
LASERTEC CORP
International Classes:
G02B5/20; G03F7/40; G09F9/00; H01L21/027; (IPC1-7): H01L21/027; G02B5/20; G03F7/40; G09F9/00
Attorney, Agent or Firm:
Ken Ieiri