Title:
METHOD AND APPARATUS FOR FIXING THIN PANEL
Document Type and Number:
Japanese Patent JP2740388
Kind Code:
B2
Abstract:
PURPOSE: To form a resin molded article of high accuracy on the outer peripheral part of a thin panel whose dimensional accuracy in an inplane direction is not too high.
CONSTITUTION: A printed circuit board 4 is fitted in the cavity 24 of the lower mold of a mold so that the protruding part 14 thereof is positioned on the extension part 34 of the cavity 211 and a base is placed on the board 4 to be pressed from above by an upper mold. The punch 32 provided to the upper mold is inserted in the escape hole 27 of the lower mold through the hole of the base and the protruding part 14 is pushed by the oblique surface 35 of the punch 32 to bring the end surface 4a of the board into close contact with a wall surface 22a. Then, a molten resin is cast into a groove 26 to be formed into a resin molded article.
Inventors:
Eiji Nara
Taichiro Iwase
Asa Takei I
Taichiro Iwase
Asa Takei I
Application Number:
JP1920092A
Publication Date:
April 15, 1998
Filing Date:
February 04, 1992
Export Citation:
Assignee:
Gunma NEC Corporation
International Classes:
B29C39/10; H05K7/14; B29L31/34; H05K3/28; (IPC1-7): H05K7/14; B29C39/10
Domestic Patent References:
| JP4779976A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)