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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR FORMING COATING FILM
Document Type and Number:
Japanese Patent JPS5898162
Kind Code:
A
Abstract:

PURPOSE: To obtain a coating film having unform and desired thickness, even when the surface to be coated with said film has slight curvature, by carrying out coating work while ejecting gas to an uncured film-forming material applied to the surface to be coated with the film.

CONSTITUTION: A metal plate 2 is mounted on a belt conveyer 3, insulating synthetic resin 5 is applied practically to the entire surface of the plate 2 or in bulk to its end part near a sprayer 1, and then the conveyer 3 is moved along the arrow. Hence, oxygen, air or the like is supplied through a flexible tube 4 to a gas reservoir 12 by the operation of the sprayer 1, and gas heated and dried by a heater 14 is uniformly ejected through a spray opening 11 onto the conveyer 3. When the plate 2 is carried under the ejected gas by the movement of the conveyer 3, uncured resin on the plate 2 is spread along a direction opposite to the running direction by the pressure of the gas. The resin is uniformly spread until the final end of the plate 2 has passed as such. Excess resin is discharged from the rear, right and left edges of the plate 2, and the uniform film of the resin 5 is obtained. Said film is then heated and cured. The ejection angle of the sprayer 1 can be adjusted by swinging an arm 13.


Inventors:
ADACHI EINOSUKE
HASEGAWA TAKETOSHI
FUJIOKA HIROFUMI
Application Number:
JP19918881A
Publication Date:
June 10, 1983
Filing Date:
December 08, 1981
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B05C11/06; B05D1/42; B05D3/04; (IPC1-7): B05C11/06; B05D1/42; B05D3/04
Attorney, Agent or Firm:
Masuo Oiwa