電子部品の製造方法及び装置

Japanese Patent JP7161814

B2

An electronic component manufacturing method comprising: a first step of moving an electronic component body (1) in a first direction (A) relative to a dip layer (3) of a conductive paste to immerse the electronic component body in the dip layer (3); a second step of moving the electronic component body relative to the dip layer in a second direction (B) that is opposite to the first direction (A), thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste (4) coated on the end portions (2) of the electronic component body and the dip layer (3), using a contact with a solid or fluid cutting means (6, 7); and a fourth step of removing excess paste (4A) from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member (6, 7).

JP3340588	[Title of the Invention] An apparatus for manufacturing an electrode foil for an aluminum electrolytic capacitor and a method for manufacturing the same.
JPH11340106	LAMINATED CERAMIC ELECTRONIC PARTS AND THEIR SORTING METHOD

Eiji Sato
Hitoshi Sakamoto

JP2022507065A

October 27, 2022

March 11, 2020

Click for automatic bibliography generation  

Creative Coatings Co., Ltd.

H01G13/00; H01C1/14; H01F41/04; H01G4/30

JP2003059786A
JP2005537928A
JP2014143362A

WO2020013237A1
WO2018070093A1

Inoue Hajime
Noboru Takekoshi
Yasushi Kuroda

Previous Patent: Mobile traffic management system and mobile traffic management method

Next Patent: Evaporation equipment