Title:
METHOD AND APPARATUS FOR MEASURING DRY ETCHING DEPTH
Document Type and Number:
Japanese Patent JP2653017
Kind Code:
B2
Abstract:
PURPOSE: To provide the method and the apparatus for measuring the etching depth during dry etching.
CONSTITUTION: An optical-axis aligning visible-light laser 1 and a long- wavelength light source 2 for measurement are connected with a coupler 3. The optical-axis alignment is readily performed with visible light. When a substrate 11, which absorbs visible light, is etched, a long-wavelength light source, whose light is not absorbed, is used as the measuring light source. The light source generates the pulse light. The laser exciting effect for the etching is decreased. A lock-in detecting system 9 is used and the S/N is increased. In the etching accompanied by the substrate, the measurement is performed in synchronization with the rotation. Thus, the vibration of the substrate and the effect of a pattern caused by the rotation are decreased. The variable wavelength light source is used for the light source. The measurement is performed at the wavelength, where the peak of the strength vibration occurs at the time of the intended etching depth.
Inventors:
YOSHIKAWA TAKASHI
OGURA ICHIRO
OGURA ICHIRO
Application Number:
JP19817193A
Publication Date:
September 10, 1997
Filing Date:
August 10, 1993
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
C23F4/00; G01B11/02; G01B11/22; H01L21/302; H01L21/3065; (IPC1-7): H01L21/3065; C23F4/00; G01B11/02; G01B11/22
Domestic Patent References:
| JP1123102A | ||||
| JP2307003A | ||||
| JP6216515A | ||||
| JP63124942A | ||||
| JP5650515A | ||||
| JP643503A |
Attorney, Agent or Firm:
Yoshiyuki Iwasa