Title:
METHOD AND APPARATUS FOR PROVIDING REINFORCED COMPOSITE MATERIALS WITH EMI SHIELDING
Document Type and Number:
Japanese Patent JP2017052280
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composite material which has EMI shielding, and to provide an apparatus which provides the composite material.SOLUTION: A method for forming an item 40 with electromagnetic interference shielding comprises the steps of : inserting a first polymer into a first compounding extruder 24, wherein the first compounding extruder provides a first melted charge; inserting the first melted charge into a second compounding extruder 26, wherein the second compounding extruder 26 introduces a plurality of conductive fibers 34 into the first melted charge and wherein the second compounding extruder 26 provides a second melted charge comprising the first melted charge and a plurality of conductive fibers; depositing the second melted charge onto at least one die of a compression mold; and closing the compression mold about the second melted charge in order to form the item.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
EDWARD J WENZEL
Application Number:
JP2016203252A
Publication Date:
March 16, 2017
Filing Date:
October 17, 2016
Export Citation:
Assignee:
INTEVA PRODUCTS LLC
International Classes:
B29C43/34; B29B7/42; B29B7/48; B29C31/04; B60K37/00; H05K9/00
Domestic Patent References:
| JP2009512774A | 2009-03-26 | |||
| JP2002348461A | 2002-12-04 | |||
| JPS59150720A | 1984-08-29 | |||
| JP2005353585A | 2005-12-22 | |||
| JP2004143241A | 2004-05-20 | |||
| JP2007296724A | 2007-11-15 | |||
| JP2007297501A | 2007-11-15 | |||
| JP2013530532A | 2013-07-25 | |||
| JP2003531750A | 2003-10-28 |
Foreign References:
| US6676864B2 | 2004-01-13 | |||
| US6186769B1 | 2001-02-13 | |||
| US7169340B2 | 2007-01-30 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto