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Title:
METHOD AND APPARATUS FOR REGENERATING ELECTROLESS COPPER PLATING SOLUTION
Document Type and Number:
Japanese Patent JPS63484
Kind Code:
A
Abstract:

PURPOSE: To efficiently recover an electroless copper plating soln. by placing a chamber between a plating soln. regenerating chamber and an anode chamber and keeping a soln. in the placed chamber alkaline so as to prevent deterioration in the function of an anion exchange membrane by the deposition of a copper ion chelating agent.

CONSTITUTION: An aqueous NaOH soln. 11, 14 is poured into a cathode chamber 30 and a second intermediate chamber 40b and an aqueous H2SO4 soln. 12 is poured into an anode chamber 50. An exhausted electroless copper plating soln. 13 is then poured into a first intermediate chamber 40a and DC voltage is applied between the cathode 1 and anode 2 from a DC power source E to regenerate the plating soln. 13. The NaOH soln. 11 in the cathode chamber 30 and the NaOH soln. 14 in the second intermediate chamber 40b are circulated with pumps P1, P2 during dialysis.


Inventors:
OTA HIROTOKU
KOBAYASHI KENJI
Application Number:
JP14217786A
Publication Date:
January 05, 1988
Filing Date:
June 18, 1986
Export Citation:
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Assignee:
NEC CORP
International Classes:
C23C18/40; B01D61/44; B01D61/50; B01D61/54; C23C18/16; (IPC1-7): B01D13/02; C23C18/40
Attorney, Agent or Firm:
Sugano Naka