PURPOSE: To effectively remove resin burr by a method wherein the lead portion where resin burr has attached is held between an abrasive piece and a pressed body, and the lead portion, the pressed body and the abrasive piece are moved relatively to each other.
CONSTITUTION: To remove resin burr 7 from the external lead 6 of the lead frame 5 of a semiconductor device 4, a pressed body 3 is raised, the external lead 6 is placed on a grindstone 1 and the pressed body 3 is lowered to hold the external lead 6, while regulating a pressure 8. Then, when the pressed body is horizontally moved, the lead frame 5 horizontally moves as one body therewith, so that the resin burr is scraped off by the end of an abrasive piece 2 on the upper surface of the grindstone 1. Subsequently, burr dust is removed by means of a rotary brush, and the lead frame is grounded to eliminate static electricity to reach completion. By said constitution, because burr is removed from the base of the resin coating, solderability remarkably improves. In addition, there is no possibility of contact failure, corrosion or oxidation. Accordingly, reliability also improves.
NUMAJIRI KAZUO
NAKADA JIYUNJI
