Title:
METHOD AND APPARATUS FOR RESIN-SEAL MOLDING OF ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3525036
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To continue the molding operation of other units and implement the maintenance inspection work or the like of necessary units by setting each unit interstice in a plurality of molding units as movement areas for a loader unit, and allowing the loader unit or the like to be moved reciprocally in the areas.
SOLUTION: When conducting maintenance inspection work only for a molding unit 5a, by ceasing operation of the molding unit 5a via a controller unit 13 and each operation of a loader unit 6 and so on relative to the loading unit 5a, maintenance inspection work can be done for the unit 5a while molding work is continued in other molding units 5b, 5c, 5d. The reciprocal movement areas of the loader unit 6 and so forth relative to the unit 5b, 5c, 5d are limited in areas 19, 20 not to run over the areas, so that a danger of collision with workers can be avoided beforehand, and its productivity can also be avoided from being lowered.
Inventors:
Hidaka, Tetsuo
Horiuchi, Kazuo
Horiuchi, Kazuo
Application Number:
JP22584497A
Publication Date:
May 10, 2004
Filing Date:
August 06, 1997
Export Citation:
Assignee:
TOWA KK
International Classes:
B29C31/04; B29C45/02; B29C45/14; B29C45/40; H01L21/56; (IPC1-7): B29C45/02; B29C31/04; B29C45/14; B29C45/40; H01L21/56
Other References:
沢田慶司，「プラスチック成形工場の自動化技術」，第六版，株式会社プラスチックス・エージ，１９９３年２月１０日，ｐ．６９−７０，ｐ．１２２−１２７
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