To provide an apparatus for separating a wafer in which the work of separating the wafer from a piled-up wafer group of a piled-up state and transferring the separated wafer to a prescribed place one by one is performed and while work stress such as friction and deformation is not applied on the separated wafer to the utmost to prevent the breakage thereof, so that the yield of the wafer can be further improved and the stable supply of the wafer can be attained.
The apparatus for separating the wafer includes: a water tank (2); an injection nozzle (3) arranged at a position close to the water surface of the water tank (2); a wafer feeder (4) for holding the piled-up wafer group (7) and moving the piled-up wafer group (7) to a water surface-side inflow part of the water injected from the injection nozzle (3); and a wafer mover (5) for holding the wafer separated from the piled-up wafer group (7) and transferring the held wafer to the prescribed place. The injection nozzle (3) is disposed so that the injected water may involve air on the water surface and a gas-liquid mixture flow containing water and air bubbles may be formed in the water.
SUEYASU KOICHI
NISHIDA DAISUKE
MIYAZU MASASHI
