Title:
積極的寸法解析を利用してケーブルにスリーブを装着するための方法及び装置
Document Type and Number:
Japanese Patent JP7418187
Kind Code:
B2
Abstract:
An apparatus that melts and monitors sleeves (12) for installation onto shielded cables (10). The apparatus includes a heat source (174) for melting the sleeve, cable supports (122a, 122b) for supporting the cable during the melting process, a sensor system (124) that is configured to measure a dimension of the sleeve during melting, and a computer (162) that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.
Inventors:
Grace Elle Duncan
Damian Oh Martin
Damian Oh Martin
Application Number:
JP2019208043A
Publication Date:
January 19, 2024
Filing Date:
November 18, 2019
Export Citation:
Assignee:
The Boeing Company
International Classes:
H02G1/14
Domestic Patent References:
| JP6506082A | ||||
| JP62047910A | ||||
| JP2009032516A |
Foreign References:
| US20180267498 |
Attorney, Agent or Firm:
Hisashi Usui
Minoru Yoshida
Tatsuya Tanaka
Yasumitsu Suzuki
Shintaro Suzuki
Keita Kobuchi
Tomokazu Saito
Minoru Yoshida
Tatsuya Tanaka
Yasumitsu Suzuki
Shintaro Suzuki
Keita Kobuchi
Tomokazu Saito
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