Title:
METHOD AND APPARATUS FOR SPUTTERING
Document Type and Number:
Japanese Patent JP2006138010
Kind Code:
A
Abstract:
To provide a method of sputtering with sputtering apparatus for depositing a layer upon a substrate which includes a sputter target with a face exposed to the substrate and a magnetron providing a magnetic field that moves relative to the target face.
The speed of movement of the field is controlled such that the uniformity of the deposition on the substrate is enhanced. A particular method includes monitoring uniformity versus speed, selecting the speed that gives the preferred uniformity and controlling the field to the selected speed. The selected speed may vary over the life of the target, with increased speeds becoming desirable as the target thins.
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Inventors:
FORD MARK ASHLEY
JAKKARAJU RAJKUMAR
JAKKARAJU RAJKUMAR
Application Number:
JP2005299954A
Publication Date:
June 01, 2006
Filing Date:
October 14, 2005
Export Citation:
Assignee:
TRIKON TECHNOL LTD
International Classes:
C23C14/35; C23C14/54; H01J37/34; H01L21/203; H01L21/285
Domestic Patent References:
| JPH11189873A | 1999-07-13 | |||
| JPH10195649A | 1998-07-28 | |||
| JPH11189873A | 1999-07-13 | |||
| JP2005350751A | 2005-12-22 | |||
| JPH10195649A | 1998-07-28 | |||
| JPH09176852A | 1997-07-08 | |||
| JP2000192239A | 2000-07-11 | |||
| JPH05255848A | 1993-10-05 | |||
| JPH0913165A | 1997-01-14 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama
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