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Patent Searching and Data


Title:
二次元材料を移すための方法及び装置
Document Type and Number:
Japanese Patent JP7401458
Kind Code:
B2
Abstract:
Aspects of the disclosure include systems and methods for removing a sample from a carrier material and depositing the sample onto a substrate. The sample can be placed in an aperture of a substrate guide on a stage within a cavity. Etching fluid can be introduced into the cavity to etch the carrier material from the sample and then drained. A rinsing material can be introduced into the cavity to rinse the etching fluid and then drained. A sample deposition process can be performed wherein rinsing fluid is introduced into the cavity to raise the sample guide and sample above the level of a substrate on a substrate holder. The substrate holder can be positioned relative to the sample guide so that the sample within the aperture aligns with the substrate on the substrate holder. The rinsing fluid is drained so that the sample is lowered onto the substrate.

Inventors:
Tory, Ethan Earl.
Application Number:
JP2020560392A
Publication Date:
December 19, 2023
Filing Date:
May 21, 2019
Export Citation:
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Assignee:
ETX Corporation
International Classes:
C01B32/194; H01L21/306
Foreign References:
US20170298504
US20100143726
EP2937313A1
WO2013146793A1
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito