PURPOSE: To apply plating to an extremely fine transparent conductive film by forming a transparent conductive film of indium oxide, tin, tin oxide, etc., on a glass substrate, immersing the above substrate into an aqueous solution containing soluble fluoride or a strongly alkaline aqueous solution and then subjecting the above substrate to activating treatment and to electroless Ni plating.
CONSTITUTION: Transparent conductive patterns 2, 3 (2 shows fine wire area and 3 shows terminal area) composed of indium oxide, tin, tin oxide, etc., are formed into an extremely fine shape on a glass substrate 1. The above substrate 1 is immersed into a soluble fluoride-containing aqueous solution containing HF of 0.5-5% concentration or a strongly alkaline aqueous solution containing NaOH of 5-20% concentration, washed with water, successively immersed into an alkaline phosphate cleaning solution, a predipping solution, a catalyst solution, and an accelerator solution to undergo activating treatment, and then immersed into an electroless Ni plating bath, by which electroless deposition of Ni is applied to the transparent conductive films 2, 3 in an extremely fine pattern shape.
KATO MITSUAKI
IIDA HIDEYO
