Title:
METHOD FOR ASSEMBLING SUBSTRATE AND APPARATUS THEREFOR
Document Type and Number:
Japanese Patent JP3535044
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To match marks to each other with high accuracy and to bond substrates to each other by moving one vacuum chamber unit with respect to the other to position the substrates to each other and narrowing the opposite spacing thereof, thereby bonding the substrates to each other.
SOLUTION: A substrate bonding section S2 is composed of the structure that an upper chamber unit 21 and a pressurizing plate 27 therein can respectively independently move vertically. Namely, the upper chamber unit 21 has a housing 30 containing a linear bushing and a vacuum seal and is moved in a vertical Z-axis direction by the shaft of a cylinder 22 fixed to a frame 3. When the upper chamber unit 21 descends, a flange of the upper chamber unit 21 comes into contact with an O-ring 44 arranged around a lower chamber 10 and mates therewith, thereby attaining the state that the units function as a vacuum chamber. As a result, the alignment marks disposed at the respective substrates may be aligned to each other with the high accuracy and the substrates are rapidly bonded to each other.
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Inventors:
Hachiman, Satoshi
Imaizumi, Kiyoshi
Saito, Masayuki
Kawasumi, Yukihiro
Hirai, Akira
Imaizumi, Kiyoshi
Saito, Masayuki
Kawasumi, Yukihiro
Hirai, Akira
Application Number:
JP17290399A
Publication Date:
June 07, 2004
Filing Date:
June 18, 1999
Export Citation:
Assignee:
HITACHI TECHNO ENG CO LTD
International Classes:
G09F9/00; G02F1/13; G02F1/1339; G02F1/1333; G02F1/1341; (IPC1-7): G02F1/13; G02F1/1339
Attorney, Agent or Firm:
武 顕次郎