Title:
METHOD FOR BENDING LEAD OF ELECTRONIC COMPONENT AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3191002
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce working cost by preventing the generation of needle-shaped slices and chips by press working, to increase the bending speed when a lead is bent using a chuck and to simplify an X/Y two-direction driving device and its executable program.
SOLUTION: At the time of bending the lead R by holding the bending part R1 on the base end side of the lead R of the electronic component 10 with a 1st chuck 1, also holding the bending part R2 on the other side with the 2nd chuck 2 and moving the 1st chuck 1 and 2nd chuck 2 relatively in parallel, by relatively making the 1st chuck 1 and 2nd chuck 2 approach by a prescribed dimension x' in the longitudinal approaching direction X while energizing them so that they are relatively separated in the bending/shifting direction X, the bending/shifting dimension (y) of the lead R is prescribed.
Inventors:
Tadao Yamada
Application Number:
JP21084496A
Publication Date:
July 23, 2001
Filing Date:
August 09, 1996
Export Citation:
Assignee:
Taiyo Densan Co., Ltd.
International Classes:
B21D5/01; B21D5/04; B21F1/00; H01L23/50; (IPC1-7): B21F1/00; B21D5/01; B21D5/04; H01L23/50
Attorney, Agent or Firm:
Juichi Kitatani
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