Title:
METHOD FOR BONDING FILM SUBSTRATE
Document Type and Number:
Japanese Patent JP2012166471
Kind Code:
A
Abstract:
To provide a bonding method that can achieve firm bonding without using a laminate resin, and is excellent in weather resistance free from the exudation of foreign matters, residual solvents and the like, in a method for bonding films formed of different materials or the same materials to each other.
The bonding method includes steps of: preparing a pair of film substrates 1, 2 formed of different materials or the same materials; irradiating a part to be bonded of at least one of the film substrates with vacuum-ultraviolet light 4; and overlapping the other film substrate on a surface of the film substrate on the side to which the vacuum-ultraviolet light 4 is emitted.
Inventors:
UEKI TAKAYUKI
YAGI IZUMI
KUROKI JUNICHI
MIYAMA HIROSHI
YAGI IZUMI
KUROKI JUNICHI
MIYAMA HIROSHI
Application Number:
JP2011029920A
Publication Date:
September 06, 2012
Filing Date:
February 15, 2011
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B29C63/02
Attorney, Agent or Firm:
Hirohito Katsunuma
Yukitaka Nakamura
Noritaka Yokota
Takeyasu Ito
Mari Asano
Yukitaka Nakamura
Noritaka Yokota
Takeyasu Ito
Mari Asano