METHOD FOR BONDING FIRST MATTER TO SECOND MATTER

Japanese Patent JP3806151

B2

PURPOSE: To rapidly bond two matters comprising an org. substance without using an adhesive in the interface of both matters by forming optically smooth complementary surfaces to two matters and subsequently bringing the surfaces of both matters to a direct contact state to form a spontaneus atomic bond.
CONSTITUTION: The complementary surfaces of two matters are subjected to optical smooth finish processing and, subsequently, these finished surfaces are locally brought into contact with each other so as not become mutually parallel. The direct bond of two matters at least one of which contains an org. substance or entirely comprises the org. substance is performed spontaneously. For example, polishing technique is adapted to two matters to provide optical smooth surfaces of which the RMS roughness is less than 2 nm to both matters. In order to form an atomic bond, the optically smooth surfaces of two matters are mutually held to a contact state without clamping two matters. Or, it is necessary to gently press the matters instantaneously. The direct bond is formed within several sec under this condition.

Yan Hai Suma
Franciscus Josephus Henry Maria van der Clewis
Hayes Bertus Adrián Cornells Maria Spierinhus

JP16108794A

August 09, 2006

July 13, 1994

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Koninklijke Philips Electronics N.V.

B29C65/00; C08J5/12; H01L21/304; (IPC1-7): B29C65/00; //H01L21/304

JP6302486A
JP2248032A
JP2046722A
JP3500394A
JP6508074A

Kosaku Sugimura
Yasunori Sato
Norita Tomita
Umemoto Masao
Takashi Nihei

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