Title:
METHOD FOR BONDING FIRST THERMOPLASTIC SUBSTRATE TO SECOND THERMOPLASTIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2022129376
Kind Code:
A
Abstract:
To provide a method for bonding a first thermoplastic substrate and a second thermoplastic substrate.SOLUTION: Each of substrates 210, 220 has a first melting temperature. In order to form a first co-bonded structure 217, a first semi-crystalline thermoplastic film 215 containing a polyaryletherketone material having a second melting temperature lower than the first melting temperature and a first thermoplastic substrate 210 are co-bonded to form a first bonding surface 219. Further, in order to form a second co-bonded structure 227, a second semi-crystalline thermoplastic film 225 containing a polyaryletherketone material having a third melting temperature lower than the first melting temperature and a second thermoplastic substrate 220 are co-bonded to form a second bonding surface 229. The first bonding surface is then fused to the second bonding surface to form a laminated structure.SELECTED DRAWING: Figure 2A
Inventors:
SHI YING
ALEXANDER M RUBIN
GREGORY J HICKMAN
ALEXANDER M RUBIN
GREGORY J HICKMAN
Application Number:
JP2022019090A
Publication Date:
September 05, 2022
Filing Date:
February 09, 2022
Export Citation:
Assignee:
BOEING CO
International Classes:
B29C65/42; B32B7/027; B32B27/00; C09J5/06; C09J7/35; C09J171/00
Attorney, Agent or Firm:
Usui Nao
Minoru Yoshida
Tatsuya Tanaka
Suzuki Yasumitsu
Shintaro Suzuki
Keita Kobuchi
Tomokazu Saito
Kazuma Tsurusaki
Minoru Yoshida
Tatsuya Tanaka
Suzuki Yasumitsu
Shintaro Suzuki
Keita Kobuchi
Tomokazu Saito
Kazuma Tsurusaki