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Title:
METHOD OF BONDING SYNTHETIC RESIN FILM
Document Type and Number:
Japanese Patent JPH023485
Kind Code:
A
Abstract:

PURPOSE: To improve adhesive strength, moisture resistance at high temps. and high humidities, etc., by bonding synthetic resin films, such as those of polyethylene terephthalate, through the use of a thermoplastic polyester adhesive to which a vinylidene chloride resin has been added.

CONSTITUTION: 0.01-20wt.% vinylidene chloride resin is added to a polyester adhesive, such as a polyethylene terephthalate having a portion of the ethylene glycol component modified by a polyglycol or the like, thereby obtaining a thermoplastic polyester adhesive. A pref. example of the vinylidene chloride resin is a copolymer of a vinylidene chloride resin as a principal component with acrylonitrile, etc. Using this thermoplastic polyester adhesive, polyethylene terephthalate films each having a thickness of about 20-200μ are bonded together at an adhesive coating thickness of about 5-50μm.


Inventors:
ITO HIROHISA
FUKUMURA RYUJI
NAKANO KUNIHIRO
KAMAKURA TAKASHI
Application Number:
JP14769088A
Publication Date:
January 09, 1990
Filing Date:
June 15, 1988
Export Citation:
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Assignee:
MITSUBISHI CHEM IND
International Classes:
B29C65/48; C08J5/12; C08L67/00; C09J167/00; B29L9/00; (IPC1-7): B29C65/48; B29L9/00; C08J5/12; C08L67/00; C09J167/00
Attorney, Agent or Firm:
Hasegawa Soji



 
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