Title:
METHOD FOR BONDING THERMOPLASTIC RESIN MATERIAL AND BONDED STRUCTURE
Document Type and Number:
Japanese Patent JP3649087
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for bonding a thermoplastic resin material with improved bonding force and to provide a bonded structure formed thereby.
SOLUTION: The polyether-imide(PEI) film 12 to be bonded is disposed on a glass epoxy substrate 10 through an alkane film 20. While an adhesiveness improving layer 15 in which the alkane is dispersed is formed at the interface between the film 12 and the substrate 10 by heating the bonding part to the glass transition temperature Tg of the PEI or higher, the film 12 is bonded to the substrate 10.
Inventors:
Toshihiro Miyake
Katsuaki Kojima
Hiroyasu Iwama
Katsuaki Kojima
Hiroyasu Iwama
Application Number:
JP2000161821A
Publication Date:
May 18, 2005
Filing Date:
May 31, 2000
Export Citation:
Assignee:
株式会社デンソー
International Classes:
C08J5/12; B29C65/42; B32B27/08; C09J5/06; C09J5/10; H05K3/36; B29K67/00; H05K3/00; (IPC1-7): C09J5/10; B29C65/42; C08J5/12
Domestic Patent References:
| JP3095230A | ||||
| JP4255779A | ||||
| JP4218581A |
Attorney, Agent or Firm:
Hirohiko Usui
Daito Kato
Takashi Ito
Daito Kato
Takashi Ito
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