PURPOSE: To inhibit the adhesion of dust and dirt on the surface of a silicon wafer with regards to a method of cleaning the silicon wafer.

CONSTITUTION: Prior to device formation, a method of cleaning a silicon wafer 2 comprises a process of dipping a silicon wafer 2 and then a lower alcohol liquid 5 in a hydrofluoric acid aqueous solution and a process of cleaning the silicon wafer 2 by water washing under the condition where the surface of the wafer 2 is kept to be still wet by the lower alcohol liquid 5.