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Title:
METHOD FOR COATING FILAMENT MAT WITH ADHESIVE AND ADHESIVE COATING APPARATUS
Document Type and Number:
Japanese Patent JP2001286799
Kind Code:
A
Abstract:

To manufacture a high performance fiberboard having sufficient adhesion capacity, to easily form a thick filament mat by enhancing the uniform dispersibility of an adhesive in a thickness direction and to reduce the cost of the adhesive.

In a method for applying an adhesive to a filament mat 2 formed from entangled lignocellulose filaments 1 with a fiber diameter of 0.01-0.5 mm and a fiber length of 6 mm or more, compressed air 4 is sprayed on the surface 2a of the filament mat 2 while the filament mat 2 is fed and the adhesive 3 is applied to the filament mat 2 in a mist form by spraying.


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Inventors:
UEDA TAKUSANE
OKUDAIRA YUZO
ONISHI KENJI
SUGAWARA AKIRA
Application Number:
JP2000108207A
Publication Date:
October 16, 2001
Filing Date:
April 10, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B05D1/02; B05B13/02; B05D7/00; B05D7/24; D04H3/12; D04H5/04; D06M13/02; D06M13/322; D06M13/395; (IPC1-7): B05B13/02; B05D1/02; B05D7/00; B05D7/24; D04H3/12; D04H5/04; D06M13/395
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)



 
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