METHOD FOR COATING NONCONDUCTIVE MOLDED PART BY USING COPOLYAMIDE HOT-MELT ADHESIVE

Title:

METHOD FOR COATING NONCONDUCTIVE MOLDED PART BY USING COPOLYAMIDE HOT-MELT ADHESIVE

Document Type and Number:

Japanese Patent JP2002060718

Kind Code:

A

Abstract:

To provide a method for coating a nonconductive molded part, capable of solving problems caused by conventional methods where a polyurethane dispersion, a moisture-curing polyurethane or a copolyamide hot-melt adhesive comprising coarse powders (200-500 μm) is applied to various molded parts comprising phenolic cured cotton fiber and melamine-cured wood waste, and then various decorative materials comprising polypropylene and polyester are adhered to the molded parts thus applied.

This method for coating the nonconductive molded part comprises coating the molded part by using a hot-melt adhesive consisting of a thermoplastic or cross-linkable copolyamide, wherein the coating is carried out in an electrostatic manner, and the copolyamide preferably comprises fine powders having a particle size of 1-200 μm.

Inventors:

WANTERKAMP PAUL-LUDWIG
SIMON ULRICH
LOSENSKY HANS-WILLI

Application Number:

JP2001196936A

Publication Date:

February 26, 2002

Filing Date:

June 28, 2001

Export Citation:

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Assignee:

DEGUSSA

International Classes:

B05D1/04; B05D7/24; C09J5/00; C09J177/00; B05D1/06; (IPC1-7): C09J177/00; B05D1/06; B05D7/24; C09J5/00

Attorney, Agent or Firm:

Toshio Yano (4 outside)

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