Title:
METHOD FOR CONTROLLING HEATER TEMPERATURE OF HOT STAMPING DEVICE
Document Type and Number:
Japanese Patent JP2001232759
Kind Code:
A
Abstract:
To save on energy consumption.
In the hot stamping device which performs a hot stamping process by heating a stamping part at a hot stamping temperature suited for the hot stamping process by a heater 2, the stamping part is adjusted to a stand-by temperature level which is lower than the hot stamping temperature with the help of a control device 4 for controlling the heater 2.
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Inventors:
KUROIWA YUKIO
Application Number:
JP2000044825A
Publication Date:
August 28, 2001
Filing Date:
February 22, 2000
Export Citation:
Assignee:
SANKYO SEIKI SEISAKUSHO KK
International Classes:
B41F16/00; (IPC1-7): B41F16/00
Attorney, Agent or Firm:
Murase Kazumi