Title:
METHOD FOR CONTROLLING TEMPERATURE CONTROL MECHANISM
Document Type and Number:
Japanese Patent JPH05250045
Kind Code:
A
Abstract:
PURPOSE:To enhance efficiency for controlling the temperature control mechanism of a system provided with many temperature control mechanisms and to reduce system cost. CONSTITUTION:At an adhesion processor 10, the temperature of a placing stand 10A and the temperature of a wafer W is controlled by a temperature control mechanism 10B, and the operation of the temperature control mechanism 10B is controlled by a multicontroller 16. Similarly, at a cooling processor 12 and a heating processor 14, the temperature of placing stands 12A and 14A and the temperature of the wafer W is controlled by temperature control mechanisms 12B and 14B, and the operations of the temperature control mechanisms 12B and 14B are controlled by the multicontroller 16. The multicontroller 16 is connected through a bus 18 to the respective temperature control mechanisms 10B, 12B and 14B and exchanges required data and control signals with the respective temperature control mechanisms 10B, 12B and 14B according to a prescribed data transmission sequence in a time division system.
Inventors:
KUDO HIROYUKI
HAGIO KAZUO
HAGIO KAZUO
Application Number:
JP8264392A
Publication Date:
September 28, 1993
Filing Date:
March 04, 1992
Export Citation:
Assignee:
TOKYO ELECTRON LTD
TEL KYUSHU KK
TEL KYUSHU KK
International Classes:
G05B21/02; G05D23/19; (IPC1-7): G05D23/19
Attorney, Agent or Firm:
Kiyoshi Sasaki