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Title:
METHOD OF CONVEYING WAFER ACCOMMODATION JIG
Document Type and Number:
Japanese Patent JPH05129416
Kind Code:
A
Abstract:

PURPOSE: To improve conveyance efficiency, and freely introduce the latest manufacturing equipment of high performance into an automated line, by installing a mounting stand for arranging wafer accommodation jigs, on a traveling equipment, constituting a robot hand as a hand protruding from a wrist toward the depth, and performing hold change of postures of three kinds of wafer accommodation jigs, on the traveling equipment.

CONSTITUTION: A mounting stand 11 on which from three to six wafer accommodation jigs 6 are arranged in a 3 shape is installed on a traveling equipment 9 which moves between semiconductor manufacturing equipments. Frame parts are formed on the upper part 23 where wafers are vertically arranged in the wafer accommodation jigs 6, and the upper part 24 where the wafers are horizontally arranged. By using clamp pawls 26, 27, 28 of a hand 8 which correspond with the respective frame parts, hold change of the wafer accommodation jigs 6 are performed on the traveling equipment 9 of a wafer conveying robot, in three postures which are as follows; wafer horizontal outlet depth, wafer horizontal outlet front and wafer vertical front. Hence conveyance efficiency can be improved, and a manufacturing equipment of high performance can freely be introduced in an automated line.


Inventors:
IKEDA MINORU
Application Number:
JP28974791A
Publication Date:
May 25, 1993
Filing Date:
November 06, 1991
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B25J5/02; H01L21/677; H01L21/68; (IPC1-7): B25J5/02; H01L21/68
Attorney, Agent or Firm:
Ogawa Katsuo



 
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