PURPOSE: To permit a cover sheet to adhere to a substrate so as to simplify the working step, by covering the whole surface of the substrate with the cover sheet except a part of the substrate, and sucking the cover sheet by a suction apparatus via the substrate.
CONSTITUTION: A suction apparatus 3 has a suction surface on the top from which a suction port 4 projects upward, and the center part of the undersurface of the substrate 1 is placed on the top of the suction port 4. Then the whole outer surface of the substrate 1 except said center part is covered with the cover sheet 2, and the cover sheet 2 is sucked via the substrate 1 by the suction apparatus 3. Thus, the cover sheet 2 is permitted to adhere to the outer surface of the substrate 1, so that the cover sheet 2 adheres even to projections 5 and under side surfaces of the substrate 1. Thereafter, the cover sheet 2 is melted by heat to be laminated on the surface of the substrate 1.
ITOU KENICHI
Next Patent: MANUFACTURE OF SHEET OR FILM OF THERMOPLASTIC RESIN