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Title:
METHOD FOR CUTTING LAMINATION BODY AND METHOD FOR CUTTING STIMULABLE PHOSPHOR PLATE
Document Type and Number:
Japanese Patent JP2000065996
Kind Code:
A
Abstract:

To cut a lamination body where no interlayer release is generated and a stimulable phosphor plate by applying a cutting blade from a layer with a small modulus of elasticity.

By applying a cutting blade 12 from a plastic film 2 with a smaller modulus of elasticity, a plastic film 2 with a smaller modulus of elasticity presses a stimulable phosphor layer 3 having a large modulus of elasticity and is deflected, thus preventing interlayer release from occurring between the plastic film 2 and the stimulable phosphor layer 3. Also, by setting a blade surface at the side of a product P of the cutting blade 12 to be 90°±5° against the stimulable phosphor plate 1, namely nearly vertically, tensile/compression stress being generated in the stimulable phosphor plate 1 at the side of the product P becomes small and the deformation of the stimulable phosphor layer 3 becomes small, thus preventing the stimulable phosphor layer 3 from being cracked and released.


Inventors:
WATABE MANABU
MURAYAMA MASAAKI
HONDA SATORU
SHOJI TAKEHIKO
Application Number:
JP23260398A
Publication Date:
March 03, 2000
Filing Date:
August 19, 1998
Export Citation:
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Assignee:
KONISHIROKU PHOTO IND
International Classes:
G21K4/00; B26F1/40; (IPC1-7): G21K4/00; B26F1/40
Attorney, Agent or Firm:
Fujishima Ijima (1 outside)