Title:
METHOD FOR CUTTING OFF SUBSTRATE USING FEMTOSECOND LASER BEAM
Document Type and Number:
Japanese Patent JP2006130557
Kind Code:
A
Abstract:
To provide a method for cutting off a substrate by using femtosecond laser beam so as to reduce a consumed cost with which the substrate is cut off by using the femtosecond laser beam where thermal expansion and shock wave are not generated around the cutting-off position in the substrate.
The method for cutting off the substrate by using the femtosecond laser beam is provided with; a step for aligning the substrates 100 on a stage; and a step for cutting off by irradiating the femtosecond laser beam 201 on the portion for cutting off the substrate aligned on the stage.
Inventors:
BOKU SEIKEN
Application Number:
JP2005197618A
Publication Date:
May 25, 2006
Filing Date:
July 06, 2005
Export Citation:
Assignee:
LG PHILIPS LCD CO LTD
International Classes:
B23K26/38; B23K26/00; B23K26/03; B23K26/08; B23K26/40; B23K101/40
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Okabe
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Asahi Shinmitsu
Katsumi Miyama
Nobuaki Kato
Kazuo
Okabe
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Asahi Shinmitsu
Katsumi Miyama
Previous Patent: FEMTOSECOND LASER BEAM GENERATOR AND SUBSTRATE CUTTING METHOD USING THE SAME
Next Patent: METHOD FOR MANUFACTURING HEAT EXCHANGER
Next Patent: METHOD FOR MANUFACTURING HEAT EXCHANGER