PURPOSE: To prevent the occurrence of electrostatic destruction even when a resin section, especially, a resin section which is easily destroyed by static electricity is electrostatically charged due to handling in or transportation from the preceding process by heating or cooling the resin section to specific temperatures in a cutting/separating punch and die.

CONSTITUTION: Plastic molded type semiconductor devices 1 connected to each other with a lead frame are separated from each other by means of a cutting punch 4 and die 5. When this plastic molded type semiconductor device 1 cutting and separating method containing the above-mentioned process is used, the resin section of the device 1 is heated to 100-175°C or cooled to 1-60°C in the punch 4 and die 5. For example, heater plates 3 heated to 100-175°C are respectively provided in the punch 4 and die 5 which separate a plurality of ICs 1 connected to each other with the lead frame so that the ICs 1 can be separated from each other by cutting external leads 2 from hung leads while the resin sections of the IC 1 are heated. Therefore, the ICs 1 can be protected from electrostatic destruction by utilizing a destaticizing effect obtained by the heating.