Title:
METHOD FOR CUTTING SINGLE CRYSTAL INGOT BY WIRE SAW
Document Type and Number:
Japanese Patent JP2004268509
Kind Code:
A
Abstract:
To provide a cutting method by a wire saw in which the efficiency of face matching work is good and the precision of face matching is high when a single crystal ingot is cut in parallel with the end surface of the ingot.
In the method for cutting the single crystal ingot by the wire saw, the single crystal ingot 32 mounted/fixed on/to a swivel table 31 is cut in parallel with the ingot end surface 32a by using the wire saw 33. The inclination of the ingot end surface 32a is detected/measured, its inclination angle is calculated, and the inclination of the end surface 32a is corrected on the basis of the inclination angle.
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Inventors:
MASUYAMA SHOJI
UEMATSU EI
UMAGAMI HIRONORI
MORI MASAMI
HORIGUCHI TADASHI
UEMATSU EI
UMAGAMI HIRONORI
MORI MASAMI
HORIGUCHI TADASHI
Application Number:
JP2003065112A
Publication Date:
September 30, 2004
Filing Date:
March 11, 2003
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
G01B21/02; B28D5/04; (IPC1-7): B28D5/04; G01B21/02
Attorney, Agent or Firm:
Nobuo Kinutani
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