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Patent Searching and Data


Title:
METHOD FOR DEMOLDING SOFT MOLDING FROM MOLD
Document Type and Number:
Japanese Patent JPH09141638
Kind Code:
A
Abstract:

To continuously demold a soft clay and kaoline from a mold before being dried without distracting the shape of the soft clay or kaoline formed by the mold by a method wherein a molding, which is formed by the mold, is demold by pressing a base plate, on which adhesive is applied, so as to be dried on the base plate.

A large number of synthetic resin base plates 3 are prepares under the condition that aqueous adhesive 4 is applied on one side of each of the base plates. When the side, on which the aqueous adhesive 4 is applied, of the bsse plate 3 is fixed under pressure against a soft clay 2 faces in a recessed mold 1, the aqueous adhesive 4 temporarily melts. Due to the stidring and bonding effect, the formed clay 2 is easily taken out of the mold and brought onto the base plate 3 so as to be dries as it is. Next, after the clay is dried so hard as not deform by touching, the clay 2 can be easily removed with a pallet or the like from the base plate 3. A dried molding is transferred to the following process so as to be turned into a product.


Inventors:
SHIMIZU MASAHISA
Application Number:
JP33765395A
Publication Date:
June 03, 1997
Filing Date:
November 20, 1995
Export Citation:
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Assignee:
SHIMIZU MASAHISA
International Classes:
B28B13/06; (IPC1-7): B28B13/06