METHOD FOR DEPOSITING CATALYST FOR ELECTROLESS PLATING ONTO SURFACE OF RESIN SUBSTRATE

Title:

METHOD FOR DEPOSITING CATALYST FOR ELECTROLESS PLATING ONTO SURFACE OF RESIN SUBSTRATE

Document Type and Number:

Japanese Patent JP2003013244

Kind Code:

A

Abstract:

To provide a method for depositing a catalyst for electroless plating onto the surface of the resin substrate, which can reduce a consumption amount of palladium and shorten the treatment process without decreasing catalytic activity, in the process of depositing the catalyst.

The method is characterized by etching the surface of the resin substrate with an etching solution including a Pd compound, and then contacting it with an aqueous solution including a reducing agent.

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Inventors:

KATAYAMA JUNICHI
NISHIMURA MITSUE
NISHIKAWA KAORI
MAEDA TAKEAKI

Application Number:

JP2001202362A

Publication Date:

January 15, 2003

Filing Date:

July 03, 2001

Export Citation:

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Assignee:

OKUNO CHEM IND CO

International Classes:

C23C18/24; C23C18/16; C23C18/28; (IPC1-7): C23C18/24; C23C18/16; C23C18/28

Attorney, Agent or Firm:

Eiji Saegusa (8 others)

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