Title:
METHOD OF DEPOSITING
Document Type and Number:
Japanese Patent JP2006120714
Kind Code:
A
Abstract:
To provide a method of stably depositing which stably supplies a material to be supplied on the substrate to be processed on the substrate to be processed in the method of depositing using a medium of a supercritical state.
The method of depositing the treatment medium which adds a precursor to the medium of the supercritical state on the substrate to be processed includes a step of adding the precursor to the medium of the super-critical state in the state that it dissolved in an organic solvent.
More Like This:
Inventors:
NARISHIMA MASAKI
MATSUZAWA OKIAKI
KOMIYA TAKAYUKI
KONDO HIDEKAZU
MATSUZAWA OKIAKI
KOMIYA TAKAYUKI
KONDO HIDEKAZU
Application Number:
JP2004304537A
Publication Date:
May 11, 2006
Filing Date:
October 19, 2004
Export Citation:
Assignee:
TOKYO ELECTRON LTD
KONDO HIDEKAZU
KONDO HIDEKAZU
International Classes:
H01L21/288; C23C16/455; H01L21/3205; H01L21/768
Domestic Patent References:
JP2007510054A | 2007-04-19 | |||
JP2004228526A | 2004-08-12 | |||
JP2003213425A | 2003-07-30 | |||
JP2003514115A | 2003-04-15 | |||
JP2004002752A | 2004-01-08 | |||
JP2003016857A | 2003-01-17 |
Attorney, Agent or Firm:
Tadahiko Ito
Previous Patent: THIN FILM PHOTOELECTRIC CONVERTER AND MANUFACTURING METHOD THEREFOR
Next Patent: MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
Next Patent: MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER