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Title:
METHOD AND DEVICE FOR ALIGNING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0577919
Kind Code:
A
Abstract:

PURPOSE: To prevent the work hindering trouble in a succeeding process by positioning either of a superior quality printed wiring board receiving part and an inferior quality printed wiring board receiving part at a receive position in response to a result of judgement by a quality judging device.

CONSTITUTION: During the inferior quality product generating signal is not output from a wiring board processing machine, a piston rod of a fluid pressure cylinder 18 is positioned at a short position, and a receiver plate 22 integrated with a frame 20 waits at a receiver plate waiting position. During superior quality printed wiring boards 30 are discharged through a receiving roller device 16, the superior quality printed wiring boards 30 are guided by a guide part 20a of the frame 20 with the discharge operation, and the positioning in the longitudinal direction and the cross direction is performed to stack the printed wiring boards 30 in order on a support plate 14. When the inferior quality product generating signal is output from the wiring board processing machine, a lifter 12 moves the support plate 14 to a support plate waiting position lower than the receive position, and the fluid pressure cylinder 18 is driven to the piston rod extending direction, and the receiver plate 22 of an inferior quality printed wiring board receiving part is lowered to be positioned a the receive position.


Inventors:
BANDO HIDEO
Application Number:
JP26688791A
Publication Date:
March 30, 1993
Filing Date:
September 19, 1991
Export Citation:
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Assignee:
JAPAN STEEL WORKS LTD
International Classes:
B07C5/36; B65G47/14; B65G47/46; B65G57/03; B65H29/22; B65H31/24; H05K13/02; (IPC1-7): B07C5/36; B65G47/14; B65G57/03; B65H29/22; B65H31/24; H05K13/02
Attorney, Agent or Firm:
Toshiyuki Miyauchi



 
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