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Title:
METHOD AND DEVICE FOR APPLYING BONDING AGENT TO DEVELOPING PLATE FOR ASSEMBLED CONTAINER
Document Type and Number:
Japanese Patent JPH05253524
Kind Code:
A
Abstract:

PURPOSE: To provide the method and a device for applying uniformly and quickly the proper amount of an adhesive into an inclined channel formed on a developing plate for an assembled container.

CONSTITUTION: A contact piece 9 is used for applying an adhesive to an inclined channel of a developing plate. Said contact piece 9 is installed at the ends of two arm levers 8, 8 used combinedly as the adhesive feeding tubes. Said arm levers 8, 8 are installed rotatably on a top section component 7 mounted swingingly left and right on upper end of a pillar 6 mounted on a base through ball bearings. The contact piece 9 is set facing above at all times by a spring 10. The upper edge of the contact piece 9 is formed into the crest shape corresponding to the inclined channel of the developing plate, and its rear end top section is formed into a slant cut section matching with the inclined channel of the developing plate, while its front end top section is formed into left and right notched sections. Adhesive jetting holes are opened respectively on the crest faces in the vicinity of said left and right notched sections. Said adhesive jetting holes are connected with the arm levers 8, 8 and also connected with an adhesive feeding pump through a hose.


Inventors:
Yukio Osawa
Takashi Ibayashi
Kurasei Yozo
Katsuhiro Shirie
Application Number:
JP8644292A
Publication Date:
October 05, 1993
Filing Date:
March 10, 1992
Export Citation:
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Assignee:
Zanpack Japan Co., Ltd.
Bern Co., Ltd.
International Classes:
B05C5/00; B05C5/02; B05D1/26; B05D7/24; (IPC1-7): B05C5/00; B05C5/02; B05D1/26; B05D7/24
Attorney, Agent or Firm:
Toshiaki Ikeura (1 outside)



 
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