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Title:
METHOD AND DEVICE FOR AUTOMATIC PLATING
Document Type and Number:
Japanese Patent JP3083138
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To achieve an excellent plating by individually and continuously moving longitudinally arranged works to be plated in a horizontal direction.
SOLUTION: In a method to plate works 25 to be plated by individually and continuously moving the works in a horizontal direction in a plating tank 3, the upper end height of each work 25 is detected, and this work 25 is plated by discharging a plating solution in the plating tank 3 from a hole 32 at the height corresponding to the detected upper end height of the work among a plurality of holes provided in a side wall of the plating tank 3 with their height different from each other.


Inventors:
Kazuo Ohba
Application Number:
JP29857297A
Publication Date:
September 04, 2000
Filing Date:
October 30, 1997
Export Citation:
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Assignee:
Sakae Electronics Co., Ltd.
Kazuo Ohba
International Classes:
C25D17/00; C25D21/00; C25D21/12; (IPC1-7): C25D17/00; C25D21/00; C25D21/12
Domestic Patent References:
JP6101099A
JP6260257U
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)



 
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