METHOD AND DEVICE FOR AUTOMATICALLY CHANGING GRINDING PAD FOR CHEMICAL MACHINE GRINDING DEVICE

Title:

METHOD AND DEVICE FOR AUTOMATICALLY CHANGING GRINDING PAD FOR CHEMICAL MACHINE GRINDING DEVICE

Document Type and Number:

Japanese Patent JPH10230449

Kind Code:

A

Abstract:

To improve the throughput and efficiency of a chemical machine grinding device by chucking a used grinding pad on a platen in a machine type device, moving this to a used pad container and removing the pad from the machine type device in the container.

A pad changing mechanism 100 places a used pad in the container 116 of a grinding device and takes a clean pad out of the dispenser 118 of the grinding device. The movable planar manipulator 102 of a fixed base is provided, and this planar manipulator 102 has a movable arm 106 and an end effector 108 operated as a pad chucking mechanism. This end effector 108 in a standard venturi blade using the attracting force of a vacuum pump for chucking a grinding pad 42. The movable arm 106 is pivotally moved around three shafts 110, 112 and 114, and the grinding pads 42 of grinding stations 35a and 36b are removed and changed.

More Like This:

JPH11165254	SUPER ABRASIVE GRAIN LAPPING SURFACE PLATE
JP2005256031	TIN-BASE SOFT METAL-MADE SURFACE PLATE AND ITS PRODUCING METHOD

Inventors:

KENNEDY DANIEL F
BELITSKY VICTOR
SHANMUGASUNDRAM ARUL

Application Number:

JP37039397A

Publication Date:

September 02, 1998

Filing Date:

December 26, 1997

Export Citation:

Click for automatic bibliography generation Help

Assignee:

APPLIED MATERIALS INC

International Classes:

B24B37/12; B24B37/20; B24B37/34; B24B45/00; H01L21/304; (IPC1-7): B24B37/00; H01L21/304

Attorney, Agent or Firm:

Yoshiki Hasegawa (4 outside)

Previous Patent: POLISHING OF FREE CURVED SURFACE AND DEVICE THEREOF

Next Patent: GRINDING DEVICE AND WORK MEASURING METHOD