To establish clearance and parallelism between a wafer and a mask detectable in a non-contacting state, without causing erroneous recognition due to the pattern on the surface of the wafer.
In a method for calibrating wafer, a plurality of measuring members 31, which detect the clearance and parallelism between the wafer W and mask M in non-contacting states and a movement adjusting means which controls the position and angle of the wafer W, by referring to the measured values detected by means of the measuring members 31 are used. Each measuring member 31 is constituted of a nozzle, a pressure chamber, and a sensor which detects the back pressure in the pressure chamber, so as to find the distance between the nozzle and wafer W by detecting the back pressure in the pressure chamber which varies, depending upon the distance, when the nozzle jets a gas onto the wafer W.
SAKAMOTO NOBUAKI
HOSOBUCHI HIROSHI
YOKOZUKA SADAAKI
MOMOSE KATSUMI
| JPH05326363A | 1993-12-10 | |||
| JPS6282731U | 1987-05-27 |
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