Title:
METHOD AND DEVICE FOR DRYING
Document Type and Number:
Japanese Patent JP3338544
Kind Code:
B2
Abstract:
PURPOSE: To prevent dust from adhering again to a platelike work so as not to cause damage to it by a method wherein a fried gas is made to flow down along the surface of the work and discharged out below.
CONSTITUTION: After a glass substrate W is cleaned, it is set on a chuck 26 inside a case 21 of a drying device 20 by a transfer device. Then, as the glass substrate W is rotated by a spinner 25, dried gas of air or nitrogen jetted out from a nozzle 33 is made to flow down from above over the surface of the glass substrate W. The died gas is made to flow along the surface of the glass substrate W to dry up residual cleaning water left on the surface of the glass substrate W and discharged out through an exhaust vent 34 provided below. By this setup, a glass substrate W can be dried out in a short time even under a normal pressure. Dust is prevented from adhering again to a platelike work, so that dust is restrained from causing damage to semiconductor device if the platelike work is a semiconductor substrate.
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Inventors:
Futoshi Shimai
Hirohito Saai
Hiroshi Kumazawa
Katsuhiko Kudo
Hirohito Saai
Hiroshi Kumazawa
Katsuhiko Kudo
Application Number:
JP2043894A
Publication Date:
October 28, 2002
Filing Date:
February 17, 1994
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H01L21/304; (IPC1-7): H01L21/304
Domestic Patent References:
| JP4287922A | ||||
| JP1120829A | ||||
| JP2304925A |
Attorney, Agent or Firm:
Tomiho Inamoto (3 outside)
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